H5ANBG8NABR-XNC

Pin/Package: FBGA-96
Outer Packaging: TRAY
Lead-Free / RoHS: Lead-Free / RoHS Compliant
Voltage (V): 1.2 V
Temperature Specification: 0°C ~ +85°C
Speed: 1600 MHz
Standard Packing Quantity:
Standard Carton:
Number Of Words: 4G
Bit Organization: x8
Density: 32G
Operating Temperature: commercial temperature (0°C ~ 85°C) & normal power
Package Material: lead & halogen free (ROHS compliant)
Hynix Memory: H
No Of Banks: Non-TSV
Die Generation: 2nd
Product Family: DRAM
Shipping Method: tray