H5ANAG6NCJR-VKC

Pin/Package: FBGA
Outer Packaging: TRAY
Lead-Free / RoHS: Contains Lead
Voltage (V): 1.2 V
Temperature Specification: 0°C ~ +85°C
Speed: 1333 MHz
Standard Packing Quantity:
Standard Carton:
Number Of Words: 1G
Bit Organization: x16
Density: 16G
Operating Temperature: commercial temperature (0°C ~ 85°C) & normal power
Package Material: lead & halogen free (ROHS compliant)
Hynix Memory: H
No Of Banks: Non-TSV
Die Generation: 4th
Product Family: DRAM
Shipping Method: tray