Core Codename: Bay Trail
Manufacturing Process: 22 nm
Socket Type: BGA 1170
Package Size: 25 × 27 mm
Base Frequency: 2.16 GHz
Max Turbo Frequency: 2.58 GHz
Cores/Threads: 4 Cores 4 Threads
L3 Cache: 2 MB
Thermal Design Power (TDP): 7.5 W
Scenario Design Power (SDP): 4.5 W
Max Memory Capacity: 8 GB
Memory Types: DDR3L-1333 MHz
Max Number of Memory Channels: 2